3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

• Author(s): Lih-Tyng Hwang, Tzyy-Sheng Jason Horng,
• Publisher: John Wiley & Sons
• Pages: 464
• ISBN_10: 111928967X
  ISBN_13: 9781119289678
  
• Language: en
• Categories: Technology & Engineering / Mobile & Wireless Communications , Technology & Engineering / Electronics / General , Technology & Engineering / Electrical ,

Description:...

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

• Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
• Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
• Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
• Provides chapter-wise review questions and powerpoint slides as teaching tools