Low Dielectric Constant Materials for IC Applications

• Author(s): Paul S. Ho, Jihperng Leu, Wei William Lee,
• Publisher: Springer Science & Business Media
• Pages: 310
• ISBN_10: 3642559085
  ISBN_13: 9783642559082
  
• Language: en
• Categories: Technology & Engineering / Electronics / General , Technology & Engineering / Materials Science / Electronic Materials , Technology & Engineering / Materials Science / General , Technology & Engineering / Electrical ,

Description:... Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for